Products: Intel & AMD CPU Cooler, Cooling Fans, Chipset Cooler, Heat Pipes, Accessories


Background and History

Dynatron Corporation was founded in 1991 in Taiwan and over the past 12 years has become one of the leading PC thermal solution providers. Dynatron established the first sales and marketing office in Fremont, California in 1995 to fully facilitate post-sales support. Since then, two more regional sales offices have been opened, one in Walnut, California and another in Miami, Florida, to distribute products more efficiently not only in the USA, but worldwide. Due to Global stronghold on the cooling solution market, with offices open now in every major continent, there is a Dynatron office open at every hour of the day.
In 1998, Dynatron moved its factory to Dongguan, China in order to expand its manufacturing capacity to meet the market growth and demands for Dynatrons products. Because of recent explosive growth in demand, Dynatron opened another factory in Suzhou (500,000 units monthly capacity) and re-routed part of production volume to this new facility. As demand for products increases further still, Dynatron are now in the process of building a new factory to cope with the rapid increase in production volume. This facility will include even more state of art manufacturing machinery, and further increase the mass production capacity by another one million units per year.

Expertise and Product Line

Dynatron excels in manufacturing both AC and DC fans from 25mm to 172mm. Dynatron also provide for OEM customers any custom-design thermal solution products. These include active coolers, passive heat sinks, heat pipes, blowers, cross flow blowers, water coolers and many more. Dynatron branded thermal solutions are widely recognized and integrated into desktop PCs, servers, workstations, notebooks, gaming machines, and storage systems. In the year 2001, Dynatron won its reputation as the first company to integrate the state of the art MicroFin Technology into a PC heat sink. Today, MicroFin Technology is considered the most advanced and efficient heat sink manufacturing method for a thermal solution and is used in most system applications.